Power chips are linked to outside circuits with packaging, and their efficiency relies on the support of the product packaging. In high-power situations, power chips are typically packaged as power components. Chip affiliation describes the electric link on the top surface of the chip, which is normally light weight aluminum bonding cord in traditional modules. ^
Traditional power module plan cross-section
Today, commercial silicon carbide power components still mostly make use of the product packaging modern technology of this wire-bonded standard silicon IGBT component. They deal with problems such as large high-frequency parasitical parameters, not enough heat dissipation ability, low-temperature resistance, and inadequate insulation stamina, which limit using silicon carbide semiconductors. The screen of superb efficiency. In order to resolve these troubles and fully make use of the massive prospective advantages of silicon carbide chips, lots of new packaging technologies and solutions for silicon carbide power components have actually emerged in recent years.
Silicon carbide power component bonding technique
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have created from gold cable bonding in 2001 to light weight aluminum cable (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power devices have developed from gold wires to copper cords, and the driving pressure is expense decrease; high-power devices have actually developed from aluminum cables (strips) to Cu Clips, and the driving pressure is to improve item efficiency. The higher the power, the higher the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging process that utilizes a strong copper bridge soldered to solder to link chips and pins. Compared to standard bonding packaging techniques, Cu Clip modern technology has the following benefits:
1. The link between the chip and the pins is constructed from copper sheets, which, to a certain extent, changes the standard cord bonding approach between the chip and the pins. For that reason, a distinct package resistance value, higher current flow, and better thermal conductivity can be obtained.
2. The lead pin welding area does not need to be silver-plated, which can fully conserve the price of silver plating and poor silver plating.
3. The product look is completely regular with regular products and is mainly used in web servers, portable computers, batteries/drives, graphics cards, motors, power supplies, and other fields.
Cu Clip has 2 bonding approaches.
All copper sheet bonding technique
Both the Gate pad and the Resource pad are clip-based. This bonding technique is a lot more expensive and complex, yet it can attain much better Rdson and much better thermal impacts.
( copper strip)
Copper sheet plus cord bonding approach
The resource pad uses a Clip method, and eviction uses a Cord approach. This bonding technique is slightly more affordable than the all-copper bonding approach, conserving wafer area (relevant to really little entrance areas). The procedure is less complex than the all-copper bonding approach and can obtain better Rdson and better thermal result.
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